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Electronic Packaging Materials & Heat Sink Materials
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Electronic Packaging Materials & Heat Sink Materials
Power electronics and circuits produce a lot of heat when they work. Heat sink materials help to eliminate chip heat, transferring it to other media and keeping the chip stable.Get more news about Electronic Packaging Silicon Aluminum Alloy,you can vist our website!
Molybdenum copper, tungsten copper, CMC and CPC materials, combined with low thermal expansion rate of molybdenum, tungsten and conductivity of copper heat, can effectively release the heat of electronic device and contributes to the cooling of IGBT module, RF power amplifier, LED chips and other products. They are thus applied as a metal substrate, thermal control and heat insulation components (heat sink materials) and the lead frame in large-scale integrated circuit and high power microwave devices.
Advantage
The composite material of Aluminum silicon carbide is the aluminum silicon carbide ceramic and matal compound and then into new materials, with all the excellent quality of ceramic and metal. It has thermal conductivity, low thermal expansion coefficient and good stiffness, light quality, so it is the ideal powder electronic substrate material and substrate material. With the electronic chip, it can realize good match after welding.Application
IGBT products by aluminum silicon carbide substrate encapsulation are widely used in high-speed rail, subway, and new engergy cars, wind power, welding robot, etc.
Advantage
SiAl can provide a better heat dissipation, can preatly prolong the service life of encapsulated power module, increase the reliability. Density of the material has light weight (2.4-2.7 g/cm3), high thermal conductivity, low thermal expansion coefficient, high stiffness, easy for machining, surface plating performance and good welding performance, good material density, high temperature resistance, corrosion resistance, etc.Application
In microwave power device, it is mainly used for electronic packaging, intergrated power module, the power electronic device such as T/R module. Using silicon aluminum alloy as base of electronic packaging materials, shell, the box body, cover plate are a good match.